ライセンス契約書
License Agreement
特許・ノウハウ
License Agreement
This Agreement made and entered into this first day of May, 2021 (“Effective Date”) by and between ●● Co., Inc., a corporation organized and existing under the laws of Japan with its principal place of business at ●●, Chiyoda-ku, Tokyo, 100-0000 Japan (“Licensor”), and ●● Co., Ltd., a corporation organized and existing under the laws of California, USA with its principal place of business at ●● (“Licensee”).
WHEREAS
WHEREAS, Licensor and Licensee entered into the Manufacturing & Supply Agreement as of the day of March 1, 2021 for the supply of products to customers;
WHEREAS, Licensor will purchase from Licensee and Licensee will manufacture and supply to Licensor, the products in the field of the electronic products and other related materials;
WHEREAS, Licensee desires to obtain, and Licensor is willing to grant, a license to manufacture and sell the said products under the said patent and know-how, subject to the terms and conditions set forth in this Agreement;
NOW, THEREFORE, in consideration of the premises and the mutual covenants herein contained, the Parties hereby agree as follows:
